Thick Film Integrated Circuits for Audio Amplifiers

Haas GC. Thick Film Integrated Circuits for Audio Amplifiers. In: AES Convention 31. Audio Engineering Society; 1966.pp. 494:1-12. Available from: https://aes.org/publications/elibrary-page/?id=947

@inproceedings{Haas1966_947,
  author = {Haas, George C.},
  title = {{Thick Film Integrated Circuits for Audio Amplifiers}},
  booktitle = {AES Convention 31},
  pages = {494:1-12},
  url = {https://aes.org/publications/elibrary-page/?id=947},
  year = {1966},
  month = oct,
  publisher = {Audio Engineering Society}
}

TY  - CPAPER
TI  - Thick Film Integrated Circuits for Audio Amplifiers
AU  - Haas, George C.
T2  - AES Convention 31
SP  - 1
EP  - 12
M1  - Paper 494
PY  - 1966
DA  - 1966/10/06
UR  - https://aes.org/publications/elibrary-page/?id=947
PB  - Audio Engineering Society
LA  - en
AB  - Thick film technology has been exploited in the development and manufacture of several new low power (1 watt) audio amplifiers in a hybrid integrated circuit form. This paper describes the merits and limitations of thick film hybrid techniques and discusses several practical amplifier circuits which demonstrate the application of this art.
ER  -