Electroacoustic-Analogous Circuit Models for Filled Enclosures

Leach J,WM. Electroacoustic-Analogous Circuit Models for Filled Enclosures. J Audio Eng Soc. 1989;37(7/8):586-592. Available from: https://aes.org/publications/elibrary-page/?id=6076

@article{Leach1989_6076,
  author = {Leach, Jr., W. Marshall},
  title = {{Electroacoustic-Analogous Circuit Models for Filled Enclosures}},
  journal = {Journal of the Audio Engineering Society},
  volume = {37},
  number = {7/8},
  pages = {586--592},
  year = {1989},
  month = jul,
  publisher = {Audio Engineering Society},
  url = {https://aes.org/publications/elibrary-page/?id=6076}
}

TY  - JOUR
TI  - Electroacoustic-Analogous Circuit Models for Filled Enclosures
AU  - Leach, Jr., W. Marshall
T2  - Journal of the Audio Engineering Society
J2  - J. Audio Eng. Soc.
VL  - 37
IS  - 7/8
SP  - 586
EP  - 592
PY  - 1989
DA  - 1989/07/06
UR  - https://aes.org/publications/elibrary-page/?id=6076
PB  - Audio Engineering Society
LA  - en
AB  - The thermodynamic and mechanical effects of filling in a closed-box loudspeaker enclosure are studied. It is shown that the acoustical-analogous circuit that models the increase in compliance due to the thermodynamic effects is a capacitor in parallel with a series resistor and capacitor, while the acoustical-analogous circuit that models the mechanical parameters of the filling material consists of an inductor in series with the parallel combination of a resistor and a series inductor, resistor, and capacitor.
ER  -