J. Backman, “Audio Applications of Electrothermomechanical Film (ETMF),” J. Audio Eng. Soc., vol. 38, no. 5, pp. 364–371, May 1990.
Backman J. Audio Applications of Electrothermomechanical Film (ETMF). J Audio Eng Soc. 1990;38(5):364-371. Available from: https://aes.org/publications/elibrary-page/?id=6029
@article{Backman1990_6029,
author = {Backman, Juha},
title = {{Audio Applications of Electrothermomechanical Film (ETMF)}},
journal = {Journal of the Audio Engineering Society},
volume = {38},
number = {5},
pages = {364--371},
year = {1990},
month = may,
publisher = {Audio Engineering Society},
url = {https://aes.org/publications/elibrary-page/?id=6029}
}
TY - JOUR
TI - Audio Applications of Electrothermomechanical Film (ETMF)
AU - Backman, Juha
T2 - Journal of the Audio Engineering Society
J2 - J. Audio Eng. Soc.
VL - 38
IS - 5
SP - 364
EP - 371
PY - 1990
DA - 1990/05/06
UR - https://aes.org/publications/elibrary-page/?id=6029
PB - Audio Engineering Society
LA - en
AB - A new type of transducer material, electrothermomechanical film (ETMF), consisting of foamized plastic film with conductive electrodes on at least one of its surfaces, is introduced, and its properties are examined, especially with regard to audio applications. Applications as both a transmitter and a receiver with either electrostatic or electrodynamic drive are introduced, and the special properties of the transducers made of the film are examined. A lumped-component model for the film is developed, and it is used to predict the behavior of the film. The predicted results are compared against measured data.
ER -