Y. Soda et al., “A Multitrack IC Head for Digital Audio,” in Proc. AES Conference: 3rd International Conference: The Present and Future of Digital Audio, Jun. 1985, pp. 3-031:1-6. [Online]. Available: https://aes.org/publications/elibrary-page/?id=4012
Soda Y, Fujiwara K, Seko S, Iida Y, Miyairi H, Uchida H, Sekiya T. A Multitrack IC Head for Digital Audio. In: AES Conference: 3rd International Conference: The Present and Future of Digital Audio. Audio Engineering Society; 1985.pp. 3-031:1-6. Available from: https://aes.org/publications/elibrary-page/?id=4012
@inproceedings{Soda1985_4012,
author = {Soda, Y. and Fujiwara, K. and Seko, S. and Iida, Y. and Miyairi, H. and Uchida, H. and Sekiya, T.},
title = {{A Multitrack IC Head for Digital Audio}},
booktitle = {AES Conference: 3rd International Conference: The Present and Future of Digital Audio},
pages = {3-031:1-6},
url = {https://aes.org/publications/elibrary-page/?id=4012},
year = {1985},
month = jun,
publisher = {Audio Engineering Society}
}
TY - CPAPER
TI - A Multitrack IC Head for Digital Audio
AU - Soda, Y.
AU - Fujiwara, K.
AU - Seko, S.
AU - Iida, Y.
AU - Miyairi, H.
AU - Uchida, H.
AU - Sekiya, T.
T2 - AES Conference: 3rd International Conference: The Present and Future of Digital Audio
SP - 1
EP - 6
M1 - Paper 3-031
PY - 1985
DA - 1985/06/06
UR - https://aes.org/publications/elibrary-page/?id=4012
PB - Audio Engineering Society
LA - en
AB - In an S-DAT system with 22 track thin film heads, the number of terminals of each recording and playback IC head is reduced to eight by using the time-division multiplex signal processing technology in order to make the head assembly compact and reliable. Using pulse-train recording in the recording IC head, the power needed to record all 22 tracks becomes less than the power for the direct recording of 1 track. The time-multiplexed reproducing signal of the playback IC head is obtained from an IC composed of an amplifier array and a multiplexer connected to the yoke type magneto-resistive playback head via a newly developed capacitor array (0.47 microfarad x 12). Utilizing high-density packaging technology, these IC heads are mounted together to make a combination IC head.
ER -