M. Hänsler et al., “MEMS based Audio Speaker Module,” in Proc. AES Convention 148, May 2020, Paper 577. [Online]. Available: https://aes.org/publications/elibrary-page/?id=20815
Hänsler M, Muraro G, Novotny C, Murphy R, Murphy R, Spötl J, Rusconi Clerici A. MEMS based Audio Speaker Module. In: AES Convention 148. Audio Engineering Society; 2020. Paper 577. Available from: https://aes.org/publications/elibrary-page/?id=20815
@inproceedings{Hansler2020_20815,
author = {Hänsler, Markus and Muraro, Giacomo and Novotny, Christian and Murphy, Richard and Murphy, Richard and Spötl, Jakob and Rusconi Clerici, Andrea},
title = {{MEMS based Audio Speaker Module}},
booktitle = {AES Convention 148},
note = {Paper 577},
year = {2020},
month = may,
publisher = {Audio Engineering Society},
url = {https://aes.org/publications/elibrary-page/?id=20815}
}
TY - CPAPER
TI - MEMS based Audio Speaker Module
AU - Hänsler, Markus
AU - Muraro, Giacomo
AU - Novotny, Christian
AU - Murphy, Richard
AU - Murphy, Richard
AU - Spötl, Jakob
AU - Rusconi Clerici, Andrea
T2 - AES Convention 148
M1 - Paper 577
PY - 2020
DA - 2020/05/06
UR - https://aes.org/publications/elibrary-page/?id=20815
PB - Audio Engineering Society
LA - en
AB - This paper introduces a novel MEMS technology based audio module for in-ear headphone applications. The device has a small form factor with the whole audio module integrated inside the tip of an in-ear headphone. It is a complete audio solution containing a surface mounted MEMS speaker, an integrated audio amplifier with energy recovery, a digital MEMS microphone as well as digital signal processing for equalization and open-loop predistortion. The module can be manufactured in an SMT line enabling fully automated high-volume mass production with low costs and high yield. The mechanical structure and key benefits of a MEMS based speaker module are discussed in detail, along with the fundamentals of the audio amplifier implementation and signal processing.
ER -