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Engineering Brief

Configuration for Testing Intermodulation of Ultrasonic Signals in the Microphone Path

Authors: Stanczak, Dominik; Banas, Jan; Prysko, Jedrzej; Trella, Pawel; Maziewski, Przemek

AES Convention 146 · Paper 505 · March 2019

Abstract

The paper presents a comparison of five configurations used to test intermodulation of ultrasonic signals. All five require the use of ultrasonic loudspeakers in an anechoic, low-noise environment. Settings vary in the number and type of digital-to-analog converters and loudspeakers, as well as connection types. Best configuration introducing a small amount of self-intermodulation for the high power of the ultrasonic signals is identified.

Details

Published in
AES Convention 146
AES Convention
146
Paper number
505
Publication date
March 6, 2019
Session subject
Microphones and Circuits
Affiliation
Intel Technology Poland, Gdansk, Poland (See document for exact affiliation information.)
Type
Engineering Brief