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Conference Paper

Modeling the Attenuation of a Loosely-Fit Insert Headphone for Augmented Reality Audio

Authors: Tikander, Miikka

AES Conference: 30th International Conference: Intelligent Audio Environments · Paper 27 · March 2007

Abstract

In Augmented Reality Audio (ARA) headsets a small microphone is integrated with an earphone. In a normal listening situation the microphone signals are directly connected to the earphones, thus the sound wave passes the headset electrically from the microphone to the earphone. However, headsets do not seal the ear canal completely, and a portion of impinging sound wave is transmitted to the ear canal as leakage around and through the headset. The characteristics of these leakage paths must be known in order to make the ARA-headset acoustically transparent. In this paper a model for leakage in loosely-fit insert headphones is introduced. The model is compared to measurement results performed with an artificial head and ear simulator. The results show that the model is capable of predicting the acoustics behavior of leakage with different types of loosely-fit insert headphones in the frequency range up to 6-7 kHz.

Details

Published in
AES Conference: 30th International Conference: Intelligent Audio Environments
Paper number
27
Publication date
March 6, 2007
Session subject
Intelligent Audio Environments
Affiliation
Helsinki University of Technology (See document for exact affiliation information.)
Type
Conference Paper