Analysis of Sound Radiated by Paperboard Die Cutting

Sadamoto A, Yamaguchi T, Nagasawa S, Fukuzawa Y, Yamaguchi D, Katayama I. Analysis of Sound Radiated by Paperboard Die Cutting. In: AES Conference: 21st International Conference: Architectural Acoustics and Sound Reinforcement. Audio Engineering Society; 2002.pp. 000103:1-4. Available from: https://aes.org/publications/elibrary-page/?id=11194

@inproceedings{Sadamoto2002_11194,
  author = {Sadamoto, Akira and Yamaguchi, Takashi and Nagasawa, Shigeru and Fukuzawa, Yasushi and Yamaguchi, Daishiro and Katayama, Isamu},
  title = {{Analysis of Sound Radiated by Paperboard Die Cutting}},
  booktitle = {AES Conference: 21st International Conference: Architectural Acoustics and Sound Reinforcement},
  pages = {000103:1-4},
  year = {2002},
  month = jun,
  publisher = {Audio Engineering Society},
  url = {}
}

TY  - CPAPER
TI  - Analysis of Sound Radiated by Paperboard Die Cutting
AU  - Sadamoto, Akira
AU  - Yamaguchi, Takashi
AU  - Nagasawa, Shigeru
AU  - Fukuzawa, Yasushi
AU  - Yamaguchi, Daishiro
AU  - Katayama, Isamu
T2  - AES Conference: 21st International Conference: Architectural Acoustics and Sound Reinforcement
SP  - 1
EP  - 4
M1  - Paper 000103
PY  - 2002
DA  - 2002/06/06
UR  - https://aes.org/publications/elibrary-page/?id=11194
PB  - Audio Engineering Society
LA  - en
AB  - This paper reports for the radiated sound that occurs under paperboard die cutting. For increasing productivity andreducing operator's task in production lines, any kind of automatic technique for detecting cutting condition is required. For this requirement, we remarked the sound radiated in the cutting process. Several sounds were measured by varying several conditions: cutting force, paper thickness, paper direction and blade tip thickness. Sound pressure level (SPL) denotes obvious difference among in each condition. It is confirmed that the cutting condition could be diagnosed by seeing SPL.
ER  -