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Convention Paper

Thermal Simulation of Loudspeakers

Authors: Chapman, Peter John

AES Convention 104 · Paper 4667 · May 1998

Abstract

This paper describes the development of a system to simulate accurately the temperatures of the voice coil and magnet assembles in moving coil loudspeakers in real-time for any program material. After initial parameter measurements on the loudspeaker there is no further need for connection to the loudspeaker, the temperatures can be simulated independently. The simulation has been verified through measurements performed on bass, midrange, and tweeter units.

Details

Published in
AES Convention 104
AES Convention
104
Paper number
4667
Publication date
May 6, 1998
Session subject
Transducers
Affiliation
Bang & Olufsen A/S, Struer, Denmark (See document for exact affiliation information.)
Type
Convention Paper