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This paper describes the development of a system to simulate accurately the temperatures of the voice coil and magnet assembles in moving coil loudspeakers in real-time for any program material. After initial parameter measurements on the loudspeaker there is no further need for connection to the loudspeaker, the temperatures can be simulated independently. The simulation has been verified through measurements performed on bass, midrange, and tweeter units.
Author (s): Chapman, Peter John;
Affiliation:
Bang & Olufsen A/S, Struer, Denmark
(See document for exact affiliation information.)
AES Convention: 104
Paper Number:4667
Publication Date:
1998-05-06
Session subject:
Transducers
DOI:
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Chapman, Peter John; 1998; Thermal Simulation of Loudspeakers [PDF]; Bang & Olufsen A/S, Struer, Denmark; Paper 4667; Available from: https://aes.org/publications/elibrary-page/?id=8513
Chapman, Peter John; Thermal Simulation of Loudspeakers [PDF]; Bang & Olufsen A/S, Struer, Denmark; Paper 4667; 1998 Available: https://aes.org/publications/elibrary-page/?id=8513
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