Silicon Microphones

Sessler GM. Silicon Microphones. In: AES Convention 97. Audio Engineering Society; 1994.pp. 3919:1-. Available from: https://aes.org/publications/elibrary-page/?id=6313

@inproceedings{Sessler1994_6313,
  author = {Sessler, Gerhard M.},
  title = {{Silicon Microphones}},
  booktitle = {AES Convention 97},
  pages = {3919:1-},
  year = {1994},
  month = nov,
  publisher = {Audio Engineering Society},
  url = {https://aes.org/publications/elibrary-page/?id=6313}
}

TY  - CPAPER
TI  - Silicon Microphones
AU  - Sessler, Gerhard M.
T2  - AES Convention 97
SP  - 1
M1  - Paper 3919
PY  - 1994
DA  - 1994/11/06
UR  - https://aes.org/publications/elibrary-page/?id=6313
PB  - Audio Engineering Society
LA  - en
AB  - New work in transducer engineering is directed toward the use of silicon technologies for the fabrication of tiny microphones. For such devices, a number of conventional transduction methods are suitable, for example the condenser, piezoelectric, and piezoresistive principles. Also under study are microphones based on sound-wave induced modulation of the drain current in a field-effect transistor or acoustic sensors, depending on the modulation of light propagation in a micromachined waveguide. Experimental silicon sensors according to all these principles have been built, with some of these already showing good acoustic properties. Most advanced are two-chip condenser microphones with external biasing; electret biasing and one-chip designs made with sacrificial-layer techniques are also under study. Future work will concern the improvement of the characteristics of all silicon microphones and the integration of amplifiers or signal-processing electronics on the microphone chip. Advantages of silicon microphones are small size (membrane areas ~ 1 mm2), low-vibration sensitivity due to small diaphragm thickness (< 1 mm ), possibility of integration of sensor and amplifier on a single chip, and potentially low cost due to batch processing.
ER  -