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Engineering Brief Open Access

MEMS based Audio Speaker Module

Authors: Hänsler, Markus; Muraro, Giacomo; Novotny, Christian; Murphy, Richard; Murphy, Richard; Spötl, Jakob; Rusconi Clerici, Andrea

AES Convention 148 · Paper 577 · May 2020

Abstract

This paper introduces a novel MEMS technology based audio module for in-ear headphone applications. The device has a small form factor with the whole audio module integrated inside the tip of an in-ear headphone. It is a complete audio solution containing a surface mounted MEMS speaker, an integrated audio amplifier with energy recovery, a digital MEMS microphone as well as digital signal processing for equalization and open-loop predistortion. The module can be manufactured in an SMT line enabling fully automated high-volume mass production with low costs and high yield.
The mechanical structure and key benefits of a MEMS based speaker module are discussed in detail, along with the fundamentals of the audio amplifier implementation and signal processing.

Details

Published in
AES Convention 148
AES Convention
148
Paper number
577
Publication date
May 6, 2020
Session subject
Posters: Loudspeakers & Microphones
Affiliation
USound GmbH (See document for exact affiliation information.)
Type
Engineering Brief