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Eventide Inc. and Politecnico di Milano are collaborating to present a versatile high-performance Network Based Modular Microphone Array System (MMAS). One advantage of the system is the ability to quickly build various linear and planar array geometries with up to 64 microphone elements (sensors) connected to a single workstation, with the option to expand up to 512 sensors by synchronizing multiple sub-systems. The system modules (eStick) consist of a 48cm linear array made of 16 MEMS microphones with an integrated Audinate Dante Power-over-Ethernet (PoE) interface. The system is intended to support a wide range of industrial and research applications, ranging from advanced sound scene analysis and manipulation to source separation, extraction, and tracking.
Author (s): Pezzoli, Mirco;
Comanducci, Luca;
Waltz, Joe;
Agnello, Anthony;
Bondi, Luca;
Canclini, Antonio;
Sarti, Augusto;
Affiliation:
Politecnico di Milano, Milan, Italy; Eventide, Little Ferry, NJ, USA
(See document for exact affiliation information.)
AES Convention: 145
Paper Number:479
Publication Date:
2018-10-06
Session subject:
Transducers
DOI:
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Pezzoli, Mirco; Comanducci, Luca; Waltz, Joe; Agnello, Anthony; Bondi, Luca; Canclini, Antonio; Sarti, Augusto; 2018; A Dante Powered Modular Microphone Array System [PDF]; Politecnico di Milano, Milan, Italy; Eventide, Little Ferry, NJ, USA; Paper 479; Available from: https://aes.org/publications/elibrary-page/?id=19743
Pezzoli, Mirco; Comanducci, Luca; Waltz, Joe; Agnello, Anthony; Bondi, Luca; Canclini, Antonio; Sarti, Augusto; A Dante Powered Modular Microphone Array System [PDF]; Politecnico di Milano, Milan, Italy; Eventide, Little Ferry, NJ, USA; Paper 479; 2018 Available: https://aes.org/publications/elibrary-page/?id=19743
@inproceedings{Pezzoli2018a,
title={{A Dante Powered Modular Microphone Array System}},
author={Pezzoli, Mirco and Comanducci, Luca and Waltz, Joe and Agnello, Anthony and Bondi, Luca and Canclini, Antonio and Sarti, Augusto},
year={2018},
month={oct},
booktitle={Journal of the Audio Engineering Society},
publisher={Engineering Brief 479; AES Convention 145; October 2018},
number={479},
organization={AES},
}
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