A Computational Model of Vented Band-Pass Enclosure Using Transmission Line Enclosure Modeling

Kim J, Lee GT, Kim J. A Computational Model of Vented Band-Pass Enclosure Using Transmission Line Enclosure Modeling. In: AES Convention 131. Audio Engineering Society; 2011. Paper 8499. Available from: https://aes.org/publications/elibrary-page/?id=16025

@inproceedings{Kim2011_16025,
  author = {Kim, Jongbae and Lee, Gyeong-Tae and Kim, Jongje},
  title = {{A Computational Model of Vented Band-Pass Enclosure Using Transmission Line Enclosure Modeling}},
  booktitle = {AES Convention 131},
  note = {Paper 8499},
  year = {2011},
  month = oct,
  publisher = {Audio Engineering Society},
  url = {https://aes.org/publications/elibrary-page/?id=16025}
}

TY  - CPAPER
TI  - A Computational Model of Vented Band-Pass Enclosure Using Transmission Line Enclosure Modeling
AU  - Kim, Jongbae
AU  - Lee, Gyeong-Tae
AU  - Kim, Jongje
T2  - AES Convention 131
M1  - Paper 8499
PY  - 2011
DA  - 2011/10/06
UR  - https://aes.org/publications/elibrary-page/?id=16025
PB  - Audio Engineering Society
LA  - en
AB  - In order to predict low frequency performance of loudspeaker systems, the lumped parameter model is very useful. However, it doesn¢¢ç¯t consider the enclosure geometry. Therefore, in some special cases, it makes serious deviation between simulation and experimental result. According to recent slim trend in IT devices, the majority of flat panel TVs and mobile devices adopt not only thin and long enclosures but also front radiating structures with waveguide. This loudspeaker system could be simplified as a vented band-pass enclosure. However due to the negligence of geometry, the effects of vent and driver location can't be considered. This paper discusses a computational model of the complicated vented band-pass enclosure using Backman¢¢ç¯s low-frequency method for slim type band-pass enclosure model. Simulation results were compared with experimental results to verify the validity of the computational model.
ER  -