L. Jensen-Link, J. Madrid, K. Baudendistal, L. Longley, and B. Karley, “Software Architecture for Audio Silicon,” in Proc. AES Conference: UK 16th Conference: Silicon for Audio, Apr. 2001, Paper uk052. [Online]. Available: https://aes.org/publications/elibrary-page/?id=10156
Jensen-Link L, Madrid J, Baudendistal K, Longley L, Karley B. Software Architecture for Audio Silicon. In: AES Conference: UK 16th Conference: Silicon for Audio. Audio Engineering Society; 2001. Paper uk052. Available from: https://aes.org/publications/elibrary-page/?id=10156
@inproceedings{JensenLink2001_10156,
author = {Jensen-Link, Leslie and Madrid, Joaquin and Baudendistal, Kurt and Longley, Lester and Karley, Brent},
title = {{Software Architecture for Audio Silicon}},
booktitle = {AES Conference: UK 16th Conference: Silicon for Audio},
note = {Paper uk052},
year = {2001},
month = apr,
publisher = {Audio Engineering Society},
url = {https://aes.org/publications/elibrary-page/?id=10156}
}
TY - CPAPER
TI - Software Architecture for Audio Silicon
AU - Jensen-Link, Leslie
AU - Madrid, Joaquin
AU - Baudendistal, Kurt
AU - Longley, Lester
AU - Karley, Brent
T2 - AES Conference: UK 16th Conference: Silicon for Audio
M1 - Paper uk052
PY - 2001
DA - 2001/04/06
UR - https://aes.org/publications/elibrary-page/?id=10156
PB - Audio Engineering Society
LA - en
AB - The ever-evoIving world of digital audio is continuously developing new technologies offering various solutions to improve the sound quality in a wide range of audio systems. This places an increasing burden on audio silicon manufacturers to support these new technologies immediately after their introduction, and in many instances even before they reach a stable level of maturity. Because of the broad spectrum of customers utilizing these technologies, product success relies not only on a competitive price but also on diversification of the functionality provided by each vendor. In order to keep up with the pace and demands of this market, it becomes necessary to find ways of designing software architectures for audio silicon that provide flexibility in usage, facilitate upgrades, and allow for repairs. This paper presents guidelines for such a design.
ER -