Authors:
Disch, Sascha; Terentiv, Leon; Koppens, Jeroen; Falk, Tommy; Leppänen, Jussi; Munoz, Isaac; Herre, Jürgen; Adami, Alexander; Silzle, Andreas; Fischer, Daniel; Setiawan, Panji; Fersch, Christof; Hanschke, Jan-Hendrik; Jelfs, Sam; de Bruijn, Werner; Eronen, Antti; Mate, Sujeet; Dick, Sascha; Borss, Christian; Delgado, Pablo M.; Trinidad, Miguel M.
Affiliation:
Fraunhofer Institute for Integrated Circuits (IIS), Erlangen, Germany; Fraunhofer Institute for Integrated Circuits (IIS), Erlangen, Germany; Fraunhofer Institute for Integrated Circuits (IIS), Erlangen, Germany; Fraunhofer Institute for Integrated Circuits (IIS), Erlangen, Germany; Fraunhofer Institute for Integrated Circuits (IIS), Erlangen, Germany; Fraunhofer Institute for Integrated Circuits (IIS), Erlangen, Germany; Fraunhofer Institute for Integrated Circuits (IIS), Erlangen, Germany; Dolby Germany GmbH, Nuremberg, Germany; Dolby Germany GmbH, Nuremberg, Germany; Dolby Germany GmbH, Nuremberg, Germany; Dolby Germany GmbH, Nuremberg, Germany; Dolby Germany GmbH, Nuremberg, Germany; Koninklijke Philips N.V., Eindhoven, the Netherlands; Koninklijke Philips N.V., Eindhoven, the Netherlands; Ericsson AB, Stockholm, Sweden; Nokia Technologies, Helsinki, Finland; Nokia Technologies, Helsinki, Finland; Nokia Technologies, Helsinki, Finland; Qualcomm Technologies Inc., San Diego, CA, USA; International Audio Laboratories Erlangen, Germany; Ericsson Telecommunicatie B.V., Breda, the Netherlands
Publication Date:
June 2026
Type:
Journal Article
Cost:
Open Access (Free to all)
